Electroless plating: fundamentals and applications |
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Índice
Preface | 1 |
Chapter 2 | 71 |
Chapter 3 | 101 |
Chapter 5 | 139 |
Chapter 6 | 169 |
Chapter 7 | 193 |
Chapter 8 | 207 |
Chapter 9 | 229 |
Chapter 13 | 331 |
Chapter 14 | 377 |
Chapter 15 | 401 |
Chapter 16 | 421 |
Chapter 17 | 441 |
Chapter 18 | 463 |
Peter Berkenkotter and Donald Stephens | 481 |
Chemical Deposition of Metallic Films from Aqueous Solutions | 511 |
Otras ediciones - Ver todo
Electroless Plating: Fundamentals and Applications Glenn O. Mallory,Juan B. Hajdu Vista previa restringida - 1990 |
Términos y frases comunes
acid activation added addition adhesion alkaline alloys aluminum anodic applications becomes borohydride catalytic cause chemical cleaning coating cobalt coercivity complex components composition concentration constant containing corrosion curves decrease density dependent deposition determined developed effect Electrochem electroless copper electroless nickel plating electroless plating electrons etch example film Finishing formaldehyde gold hardness heat hydrogen hypophosphite immersion increased initial ions layer lead lower magnetic materials measured mechanism metal method nickel deposits observed obtained occur operating oxidation palladium particles patent percent plating bath plating rate plating solution polarization potential prepared present problems produced properties range reaction reducing agent removed reported resistance result rinse salt shown shows silver sodium solution specific stabilizer steel step stress structure substrate surface Table tank techniques Teflon temperature thickness treatment typical usually values wear