Materials Science of Thin Films
Elsevier, 20 oct. 2001 - 794 páginas
This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field.
Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.
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Chapter 3 ThinFilm Evaporation Processes
Chapter 4 Discharges Plasmas and IonSurface Interactions
Chapter 5 Plasma and Ion Beam Processing of Thin Films
Chapter 6 Chemical Vapor Deposition
Chapter 7 Substrate Surfaces and ThinFilm Nucleation
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activation energy adatoms adhesion alloy amorphous applications atoms bonding bulk cathode chemical chemical vapor deposition coating collisions composition compound compound semiconductors crystal crystalline density deposition rate devices dielectric diffraction diffusion dislocation effects electrical electromigration electron ellipsometry energy epitaxial films equation equilibrium etching evaporation example Figure film and substrate film deposition film growth film surface film thickness flux formation GaAs gases grain boundaries heat heteroepitaxial impingement integrated circuits interdiffusion interface ion bombardment ionization kinetic laser lattice layer LPCVD magnetron materials measured mechanical melting metal films microscope MOCVD molecules nitride nucleation occurs optical oxide phase plane plasma polycrystalline pressure properties pump reaction reactive reactor Reprinted result Schematic Section semiconductor shown in Fig silicide silicon solid species sputtering stoichiometry stress structure substrate substrate temperatures target techniques tensile stress thermal thermodynamic thin films thin-film deposition tion torr typically vacuum values wafer X-ray