Materials Science of Thin Films

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Elsevier, 20 oct. 2001 - 794 páginas
This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field.

Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.
 

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Índice

Chapter 1 A Review of Materials Science
1
Chapter 2 Vacuum Science and Technology
57
Chapter 3 ThinFilm Evaporation Processes
95
Chapter 4 Discharges Plasmas and IonSurface Interactions
145
Chapter 5 Plasma and Ion Beam Processing of Thin Films
203
Chapter 6 Chemical Vapor Deposition
277
Chapter 7 Substrate Surfaces and ThinFilm Nucleation
357
Chapter 8 Epitaxy
417
Chapter 9 Film Structure
495
Chapter 10 Characterization of Thin Films and Surfaces
559
Chapter 11 Interdiffusion Reactions and Transformations in Thin Films
641
Chapter 12 Mechanical Properties of Thin Films
711
Index
783
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Sobre el autor (2001)

Dr. Milton Ohring, author of two previously acclaimed Academic Press books,The Materials Science of Thin Films (l992) and Engineering Materials Science (1995), has taught courses on reliability and failure in electronics at Bell Laboratories (AT&T and Lucent Technologies). From this perspective and the well-written tutorial style of the book, the reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices; acquire skills in the mathematical handling of reliability data; and better appreciate future technology trends and the reliability issues they raise.

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