Electroless Plating: Fundamentals and Applications

acid activation addition adhesion alkaline alloys aluminum anodic applications autocatalytic borohydride catalytic cathodic chemical chloride cleaning cobalt codeposited coercivity complexing agent components concentration containing current density decrease deposition rate DMAB EDTA Electrochem electroless copper bath electroless copper deposition electroless deposition electroless nickel coatings electroless nickel deposits electroless nickel plating electroless nickel solutions electroless plating electrolytic electrons electroplating etch ethylenediamine film formaldehyde gold H₂O heat hydrazine hydrogen hydroxide hypophosphite immersion increased layer magnetic materials mechanism Metal Finishing method mixed potential Ni-B Ni-P nickel ions nitric acid obtained operating oxidation palladium partial reaction particles percent phosphite phosphorus phosphorus content plastic plating bath plating rate plating reaction plating solution polarization curves polypropylene pretreatment properties reducing agent replenishment result Rochelle salt salt silver sodium sodium hypophosphite stabilizer steel stress substrate sulfuric acid surface Table tank temperature thickness typical U.S. patent Water rinse zinc zincate µm/hr